Qualcomm plans to introduce data center chip technology to smartphones to improve end-side AI capabilities

On June 27, Qualcomm executive vice president Durga Maradi said that the company plans to apply the newly released data center chip technology this week to smartphones to improve the local AI performance of mobile devices. Qualcomm's new High Bandwidth Computing (HBC) architecture uses a vertically stacked chip design that closely integrates memory and computing cells, which can significantly improve data transfer speed and efficiency. The first generation of this architecture will be launched in data centers next year and is expected to be commercially available in 2028. Maradi said that "data center technology will not stop there" and the company is currently negotiating with smartphone, personal computer and car manufacturers on related technologies.